Probe Station (CASCADE, USA):

Technical and Characterization Specifications:

• Box type four and Six probe work stations.
• Highly-precise manual probe platform for wafers and substrates upto 150mm
• Supports a wide variety of applications such a I-V/C-V, radio frequency (RF), mm-wave and sub-THz measurements, devices and wafer characterization tests (DWC), failure analysis (FA), submicron probing, MEMS, optoelectronics engineering test.
• Its stable platen is designed to accommodate upto sixteen positions, providing a function similar to a probe card for special wafer-level reliability (WLR) applications.
• Associated with semi-conductor   characterization system.
• Digital camera for live imaging